|
|
|
Saru -Ishikawa lead free solder paste is available in a variety of chemistries , alloys, powder mesh sizes & packaging .
With out constant R & D we have developed a new technology - CC Mechanism ( Cyclic catching Mechanism : CCM )
This has helped us improve some of the characteristics listed below |
|
|
Reduction in deterioration of paste as time passes |
|
Wettability |
|
Reduced Voids |
|
Electric Reliability |
|
|
|
|
|
|
Ishikawa |
Flux Percentage |
C |
9.50% |
D |
10% |
E |
10.50% |
F |
11% |
G |
12% |
J |
13% |
K |
14% |
L |
14.50% |
|
|
|
|
Solder Powder Denomination |
|
Particle Size |
Mesh |
IPC Type |
|
150-75µm |
-100/200 |
1 |
|
75-45µ m |
-200/+325 |
2 |
|
55µ m |
-270/+400 |
N.A. |
J |
45-25µ m |
-325/+500 |
3 |
K |
38-25µ m |
|
|
P |
38-20µ m |
-400/+635 |
4 |
N |
32-15µ m |
-400 |
|
M |
25-10µ m |
-500 |
|
N |
25-15µ m |
-500 |
5 |
A |
15-5µ m |
|
6 |
|
|
|
Paste Packing Option |
Jar |
500gm / 1 kg |
Syringe |
10cc/30cc/500gm/1000gm |
|
|
|
|
1 |
J3, R4-8900-K-E/F |
J3-Sn-3.0Ag-0.5Cu |
8900 |
NC |
0.01 |
K-38-25µm |
E-10.5%, F-11% |
217 |
220 |
stable viscosity ,void prevention and wettability |
3 months |
For application in all industries (Energy meter,consumer electronics,mobile ) |
R4-Sn-0.7Cu-0.3Ag |
8900 |
NC |
0.01 |
K-38-25µm |
E-10.5%, F-11% |
217 |
226 |
stable viscosity ,void prevention and wettability |
3 months |
For application in all industries (Energy meter,consumer electronics,mobile ) |
2 |
J3-8600-KF |
J3-Sn-3.0Ag-0.5Cu |
8600 |
NC |
0.01 |
K-38-25µm |
F-11% |
217 |
220 |
No slump, No solder Ball, Fine Pitch Application |
3 months |
High Reliability |
3 |
J3-8800-K-E/F |
J3-Sn-3.0Ag-0.5Cu |
8800 |
NC |
0.01 |
K-38-25µm |
E-10.5%, F-11% |
|
220 |
for high temperature heating |
3 months |
they are promoting for quanta- IBM,DELL,HP specilize for mother board) |
4 |
J3-8840-K-G |
J3-Sn-3.0Ag-0.5Cu |
8840 |
NC |
0.01 |
K-38-25µm |
G-12% |
217 |
220 |
improved wetting,no solder ball ,used in high density pcb |
3 months |
for mobile,digital camera,connectors |
5 |
J3-8843-K-G |
J3-Sn-3.0Ag-0.5Cu |
8843 |
|
0.01 |
K-38-25µm |
G-12% |
217 |
220 |
Good wettability & Antioxidation effect of Flux |
3 months |
|
6 |
J3-8850-K/UG |
J3-Sn-3.0Ag-0.5Cu |
8850 |
NC |
0.01 |
K-38-20µm |
G-12% |
217 |
220 |
Anti tombstonning , Wide process window |
6month |
For Consumer Electronics , Medium Reliability Industries , Motherboards |
7 |
J3-8752-K-E/F |
J3-Sn-3.0Ag-0.5Cu |
8752 |
NC |
0.01 |
K-38-25µm |
E-10.5%, F-11% |
217 |
220 |
|
3 months |
design paste for low end pcb,generally china's and tiwan's mobile |
8 |
J3-9001-K-E/F |
J3-Sn-3.0Ag-0.5Cu |
9001 |
NC |
0.05 |
K-38-25µm |
E-10.5%, F-11% |
217 |
220 |
flux resudce can be removed/cleaned by DEIONIZED water |
3 months |
use in digital camera, mobile camera, laptop camera |
9 |
Y7-8571-K-E/F |
Sn-3.5Ag-8.0In-0.5Bi |
8571 |
NC |
0.1 |
K-38-25µm |
E-10.5%, F-11% |
195 |
208 |
paste designed for low melting components,due to presense of indium- price is high |
3 months |
use in digital camera,mobile |
10 |
Z2-7920-K-E/F |
Sn-8.0Zn-3.0Bi |
7920 |
NC |
0.02 |
K-38-25µm |
E-10.5%, F-11% |
187 |
197 |
paste design for low melting components ,due to presense of zinc- price is low |
3 months |
use in digital camera,mobile |
|
|
|
Evasol lead free solder paste with halide content(Syringe packing,40cc and 100cc) |
|
|
|
|
11 |
J3-3229-JK |
J3-Sn-3.0Ag-0.5Cu |
3229 |
NC |
0.08 |
J-45-25µm |
K-14% |
217 |
220 |
soldering done through lazer heating |
3 months |
for automobile industries-tyota(corporate approval),nisan,honda,penasonic |
12 |
J3-3230-KK |
J3-Sn-3.0Ag-0.5Cu |
3230 |
NC |
0.09 |
K-38-25µm |
K-14% |
217 |
220 |
soldering done through lazer heating |
3 months |
for automobile industries-tyota(corporate approval),nisan,honda,penasonic |
|
|
|