Saru-Ishikawa solder paste is a unique blend of low oxides, high purity solder powder with various paste flux formulation. Our portfolio of solder paste material addresses a variety of manufacturing requirement and offer performance charactersitcs unmatched by any other material supplier. Whether your surface mount assembly requires no clean, RMA (Rosin Mildly Activated) or water soluble type solder paste,Saru-Ishikawa provides you with the right solder paste to achieve high productivity and reduce production cost
 
Sl Solder Paste Type   Solder Paste Description Alloy  Type Flux Type Flux Classification IPC ( J-STD-004)  Halide Content(%) Powder Size Flux content ( code ) % Solidus Temp C  Liquidus  Temp  C Shelf Life  Paste Properties 
1 NoClean Solder Paste BH63K878DH BH63-Sn63-Pb37 878 ROLO 0.12-0.14 K-38-25 µ m D-10%  183 183 6 months  ● Halide free
●  It’s a pin-testable  solder paste
● Excellent  humidity resistance
● Broad process window both for reflow & printing
●It meets J-STD-004/005  requirements &complies with Bellcore specifications. 
 
2 BH62K878DH  BH62-Sn62-Pb36-AG2  878 ROLO 0.12 K-38-25 µ m D-10%  179 184 6 months 
 
3 B184K878DH  B184-Sn62-AG-0.4-PB-Rem 878 ROLO 0.12 K-38-25 µ m D-10%  179 184 6 months 
1 Water soluble Solder Paste  BH63JWS16E BH63-Sn63-Pb37 WS16 ORH1 0.12 J-45-25 µ m E-10.5%  183 183 6 months  ● High  performance
● Water washable solder paste .
● Residues are readily removed with De Ionized water , without the need for a saponifier .
● Can leave it open to the atmosphere for a long time without any effect on the printing definition.
● Designed for  surface Mount & medical  electronics assembly application .
1 RMA & RA Solder Paste  BH63K7030C BH63-Sn63-Pb37 7030 RMA 0.12 K-38-25 µ m C-9.5%  183 183 6 months 

●Meets/exceeds  J-STD-004/J-STD-005 standardisation
 
2 BH62K7030C BH62-Sn62-Pb36-AG2  7030 RMA  0.12 K-38-25 µ m C-9.5%  179 184 6 months 
 
Characterstics
High Speed printing
Reflow with or without nitrogen
Excellent wettability
Stencil life > 12 hours
Tact time > 24 hours
Low void
Pin probe testable residue/td>
 
Solder Powder Denomination
Ishikawa Particle Size Mesh Size  IPC Type
150-75μm   -100/200 1
75-45µ m  -200/+325 2
J
 45-25µ m  -325/+500 3
K
 38-25µ m  -400/+500  
P
 38-20µ m  -400/+635 4
N
 32-15µ m -400  
M
 25-10µ m -500  
N
 25-15µ m -500 5
A
 15-5µ m -635 6
Flux Percentage Denomination
Ishikawa Flux Percentage
C 
 9.50%
D
 10%
E
 10.50%
F
 11%
G
 12%
J
 13%
K
 14%
L
 14.50%
Flux Range
Flux% Flux% Range
1.2% 1.2-1.3%
1.6% 1.6-1.7%
2.2% 2-4%
2.78% 2-4%
Paste Packing Option
Jar 500gm / 1 kg
Syringe 10cc/30cc/500gm/1000gm
 
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